EpoxyBond 110™ is a hard,fast-curing epoxy adhesive commonly used to bond glass cover slips to small or delicate samples (i.e.,IC's) , adhere multiple samples for TEM stacking,precoat samples prior to encapsulation,fill PCB microvias and for other mounting applications.The two part formula is mixed 10 to 1 and cures bubble free in 5 minutes at 150℃(302℉).Once cured,it is chemically resistant to etchants and will not outgas under vacuum.
|
M-Bond 610 is excellent for adhering multiple samples for TEM dimpling and bonding of post-polished samples to grids for TEM and FIB observation.It is chemically resistant and provides a very thin glue line that ion mills evenly.
Loc-Tite 460™ is a thin,fast curing glue used as an alternative to wax for adhering samples to Pyrex for TEM/FIB thinning and is soluble in acetone. |
