■ Cold Mounting ■ Cold mounting materials are used to encapsulate samples that cannot withstand the heat and pressure of compression mounting,when better flow and penetration of the mounting material is needed or when a large quantity of samples must be encapsulated at once.
壓克力冷埋樹脂組
Acrylics：Typically chosen for their rapid cure times,acrylics are used when large volume sample throughput is needed.
環氧樹脂組
Epoxies：Typically chosen for their excellent flow and penetration,epoxies are used when better adhesion,less shrinkage and clarity are required.
快速成型壓克力冷埋樹脂組
■ QuickCure Acrylic ■ QuickCure offers good clarity,flow,bonding and grinding characteristics,for a wide variety of materials.
Features： ※Cure time：15-20 minutes ※82 Shore D hardness ※Excellent clarity
超快速成型壓克力冷埋樹脂組
■ QuickSet Acrylic ■ QuickSet is used to encapsulate a wide variety of matallographic specimens,especially printed circuit boards and other electronic components.
Features： ※Cure time：6-8 minutes ※84 Shore D hardness ※Excellent hole penetration on PCB's ※Low shrinkage improves adhesion
快速成型環氧樹脂組
■ EpoxyMount ■ A fast-curing epoxy that hardens in 2 hours room temperature while still maintaining quality characteristics such as good adhesion,hardness and minimal shrinkage.
Features： ※Cure time：2 hours,room temperature ※Heat(100°F) accelerates cure time to 45 minutes ※87 Shore D hardness
環氧樹脂組
■ EpoxySet■ A very low viscosity epoxy offering excellent flow and penetration.It is extremely hard,crystal clear,and exhibits firm adhesion with virtually no shrinkage.Low curing temperature is ideal for heat sensitive samples.
Features： ※Cure time：8 hours,room temperature ※89 Shore D hardness ※Excellent adhesion,with virtually no shrinkage ※Low viscosity allows for penetration into small crevices/holes ※Peak curing temperature：130°F(54°C)
