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Evaporation：
※ Wide range of coating techniques using
boats, baskets, crucibles and baffle boxes.
※ Compact source holder designs with flexible
positioning in chamber.
※ Multiple sources and mixed technology, (mix
with sputtering or E-beam).
※ Water-cooled sources and high output
power supplies gives wide range of
deposition materials. |
|
Sputtering：
※ Compact sputter head design with total
freedom of positioning in chamber.
※ Wide range of coating materials using DC or
RF power.
※ Multiple heads and mixed technology, (mix
with resistive evap or E-beam).
※ Regular or water cooled options. |
|
Mixed Technology Coating：
※ Chamber designed for combined use of
sputtering and evaporation techniques.
※ Programmable turbo-drag pump allows rapid
changeover from sputtering pressure to
evaporation pressure.
※ Sputter heads with swing-in/swing-out
positioning and close fitting shutters.
※ Multiple sputter heads and multiple evap
sources in a single deposition cycle. |
|
Thickness Measurement：
※ Accurate thickness measurement using
compact low cost monitors.
※ Chamber furniture designed for multiple
thickness monitor heads.
※ Thickness controller/terminator option. |
|
Power Supplies：
※ Dual output resistive supplies up to 400A
continuous rating.
※ Twin sputter supplies for simultaneous
deposition of two materials.
※ Electron beam evaporation supplies for
water-cooled mini bent beam gun.
※ All power supplies fitted with pre-wired
feedthroughs and vacuum safety switches. |
|
Feedthroughs：
※ Single and multiple feedthroughs for water
based on a range of KF and ISO flanges.
※ Instrumentation feedthroughs for
measurement, thermocouples and heaters.
※ LT and HT power feedthroughs with integral
vacuum switch and KF40 connector flange.
※ Liquid nitrogen feedthrough system. |
|
Pump Stations：
※ Fully automatic desktop pump station based
on turbo drag pump.
※ Rapid and safe automatic switchover from
high vacuum to sputtering pressures.
※ Inert gas standby feature gives very rapid
pump down. |
