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力丞儀器提供各式掃描式電子顯微鏡 scanning electron microscope SEM 、 FIB-SEM (Focused Ion Beam scanning electron microscope ) 聚焦離子束掃描式電子顯微鏡 sem 掃描式電子顯微鏡樣品製備 場發射掃描式電子顯微鏡 掃描式電子顯微鏡應用 掃描式電子顯微鏡原理 掃描式電子顯微鏡操作
 
[ 電子顯微鏡 | 聚焦離子束掃描式電子顯微鏡 | FIB_SEM XMU ]
■ FIB_SEM XMU聚焦離子束掃描式電子顯微鏡可變真空系統(高/低真空機型)
  The is a favorable combination of the electron and ion sources and optical columns attached on one chamber. It extends imaging qualities of the scanning electron microscope with the possibility of surface modification by a focused ion beam.
》SEM Specific Features
  • A unique four-lens Wide Field Optics? design offering the variety of working and displaying modes embodying the Tescan proprietary Intermediate Lens for the beam aperture optimization
  • Fast imaging rate, using first class YAG detectors
  • Fully automated microscope set-up including electron optics set-up and alignment
  • Live stereoscopic imaging for accurate 3D navigation
  • Network operations and built-in remote access/diagnostics, all come as a Tescan standard
  • 5-axis fully motorized compucentric stage with extra wide range of movements
FIB Specific Features
  • Unique ion optic column differentially pumped, with 2 ion pumps, for ultra-low ion scattering effect
  • Motorized aperture changer with ultra-high reproducibility
  • Beam Blanker and Faraday cup included as a standard
  • Simultaneous SEM imaging with FIB etching or deposition
  • FIB control is fully integrated in the SEM software
  • Powerful toolbox for basic shapes creation with programmable process parameters
GIS Option Features
  • Ideal geometrical configuration with respect to SEM and FIB columns
  • 5 independent gas reservoirs with capillaries
  • 3-axis microstage with automatic nozzles positioning
  • Automated temperature control

Models

  • XMH - A high vacuum variant of FIB-SEM
  • XMU - A variable pressure FIB-SEM with an extended facilities for low vacuum SEM investigation.
The XMU Essential Specifications:
 
SEM
FIB
Electron/ Ion Gun Tungsten heated filament Ga liquid metal ion source
Resolution 3.5 nm at 30 kV <5 nm at 30 kV
Magnification 3× – 1,000,000× 150× – 1,000,000×
Accelerating Voltage 200 V to 30 kV 1 kV to 5 kV;
10 kV to 30 kV
Probe Current 1 pA to 2 μA 1 pA to 20 nA
Gun vacuum < 1 × 10 -2 Pa < 5 × 10 -6 Pa
Chamber Vacuum
High Vacuum Mode
Medium Vacuum Mode
Low Vacuum Mode
< 1 × 10 -2 Pa
  3-150 Pa
  3-500 Pa
< 1 × 10 -2 Pa
  -
  -
Scanning Working Modes Resolution, Depth, Field, Wide Field, Rocking Beam, 3D Beam Live stereoscopic imaging, E-Beam induced deposition*1, E-Beam Litography Imaging, SEM-FIB Simultaneous Imaging, Etching, Polishing, Selective etching*1, I-Beam induced deposition*1
Scanning Features Focus Window, Dynamic Focus, Point & Linescan, Tilt Correction, 3D Beam Focus window, Poin, Line, Rectangle, Circle, Ring, Staris, Bitmap, Text
Scanning Speed 160 ns to 10 ms per pixel 160 ns to 10 ms per pixel
Digital Output Image size up to 8,192×8,192 pixels
Bit Depth 16-bits per channel
System control PC Control All functions are fully PC controlled by means of the LyraTC GUI software on a Windows? platform
Controlers trackball
Chamber XM Internal Dimensions 300 mm (width) x 300 mm (depth)
Door Size 280 mm (width) x 310 mm (height)
Number of Ports 9 +
Chamber Suspension pneumatic or optional active vibration isolation
Specimen Stage Type 5-axis fully motorized, compucentric
Movements X = 130 mm
Y = 130 mm
Z = 100 mm
Rot.: 360° continuous
Tilt*2: -20° to +80°
Maximum Specimen Height 137 mm
*1: Only if GIS option is installed
*2: Standard number and configuration of ports can be modified to customer needs from WD 15 mm and for eucentric height of the specimen
Detectors Accessories
SE Everhardt-Thornley
Retractable BSE
LVSTD
TE Detector
CL Detector
EBIC
EDX*
EBSD* +
Probe Current Measurement
Touch Alarm
IR Chamber View Camera
FIB Beam Blanker
SEM Beam Blanker
Gas Injection System*
Active Vibration Isolation*
Magnetic Field Cancelling System*
Nanomanipulators*
standard, option, – not available
* Fully integrated third party tools
+ EBSD is not available if GIS option is installed

     
 
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update: 2012-05-08